TSXDET1612 封測需求的爆發也導致其上游材料陷入了緊缺狀態，其中，封裝基板是所有封測上游材料中最為緊缺的產品。筆者從業內了解到，在封裝基板缺貨最嚴重的時期，封測廠商給下游客戶的交期長達1年。
FC-BGA基板核心材料ABF被壟斷
早在2020年11月，集微網就了解到，業內FC-BGA基板的缺貨非常嚴重，當時該類型的基板交期已經高達10到12個月，特別是8層、12層的產品交期更長，而且基板廠還不一定接客戶訂單。
FC-BGA基板是能夠實現LSI芯片高速化與多功能化的高密度半導體封裝基板，可應用于CPU、GPU、高端服務器、網絡路由器/轉換器用ASIC、高性能游戲機用MPU、高性能ASSP、FPGA以及車載設備中的ADAS等。
對此，集微網采訪某國內半導體封測領域得知，因為疫情的出現，CPU、GPU等LSI芯片需求量倍增，從而帶動大尺寸的FC-BGA基板去年一整年都處于產能緊缺的狀態，而FC-BGA基板缺貨的根本原因在于其核心材料ABF缺貨。
此前，業內就曾多次傳出ABF供應不足的傳聞。有媒體報道稱，自2020年秋季開始，臺積電的ABF存貨就不足了。此外，有產業鏈人士透露，ABF的交付周期已經長達30周。
“ABF（AjinomotoBuild-upFilm：味之素堆積膜）被日本的一家生產味精的廠商味之素所壟斷，但需求爆發太快，產能跟不上，而日本廠商在擴充方面相對而言較為謹慎。”
資料顯示，味之素是世界上的氨基酸供應商之一，產品涉及食品、藥品等多個領域。業內人士指出，ABF材料缺貨預計持續到2022年，味之素現在只對此前已經有下訂單的客戶才能給出交期，對新客戶就根本不接單了。
由于該領域存在壟斷性質，下游封測廠商除了開發新的基板供應商，對因上游ABF材料缺貨，引發的FC-BGA基板產能緊缺問題基本沒有解決辦法。
集微網從業內了解到，封裝基板主要分為FC-BGA/PGA/LGA、FC-CSP、FC-BOC、WB-PBGA、WB-CSP、RF&DigitalModule.六大類產品。
其中，FC-BGA是整個封裝基板領域中產值的產品，占比高達4成，但國內基板廠商尚未量產FC-BGA產品，封測廠商主要向日韓臺基板廠商采購FC-BGA基板。
不過，深南電路、珠海越亞、興森科技、華進等幾家內資廠商均布局了FC-BGA基板業務，其中珠海越亞已經進入打樣階段。
常規封裝基板交期長達3個月或半年
事實上，封裝基板處于產能緊缺的狀態已經超過一年時間了，缺貨的也不僅僅是FC-BGA基板，其他類型的封裝基板同樣很缺。
2020年，臺系封裝基板大廠欣興電子曾發生多次失火事件，讓原本就缺貨的基板行業更是雪上加霜。
知情人士表示，欣興失火燒掉了很多芯片尺寸覆晶封裝（FC-CSP）載板，導致該產品在短時間內市場缺貨極度嚴重。
據了解，FC-CSP載板可實現產品的輕薄、小型、高密度化，主要用于智能手機、數碼相機等消費電子以及5G相關領域。
業內人士表示，從目前的市場情況來看，大尺寸的FC-BGA基板缺貨最為嚴重，其他常規的封裝基板缺貨也很嚴重，交期基本都在三個月到半年，有的甚至是一年，預計到2022年才能逐步回歸到相對正常的水平。
據介紹，常規的封裝基板并不需要ABF材料，只需要BT樹脂即可，BT樹脂的供應商包括日本三菱瓦斯化學公司以及日立化成等，相對ABF而言，BT樹脂的產能較為充足，但因為封測市場的需求量忽然暴增，常規封裝基板廠商的產能也完全跟不上。
值得一提的是，相對基于ABF材料生產的封裝基板，常規的封裝基板產能提升較為簡單。業內人士指出，只要基板廠擴產，常規的封裝基板缺貨就能得以緩解。
在常規的封裝基板領域，深南電路、興森快捷、珠海越亞等內資廠商的產品已經量產，技術也相對成熟，且已經陸續宣布擴產。
不過，由于國內廠商生產規模有限，因此在成本方面并不占據優勢。業內人士認為，隨著國內基板廠商規模逐步擴大，后續成本優勢會很明顯。
TSXDET1612
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