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SICK S30B-2011BA 

SICK S30B-2011BA

在進行PCB設計時，為了使高頻電路板的設計更合理，抗干擾性能更好，應從以下幾方面考慮（通用做法）：

1） 合理選擇層數

在PCB設計中對高頻電路板布線時，利用中間內層平面作為電源和地線層，可以起到屏蔽的作用，有效降低寄生電感、縮短信號線長度、降低信號間的交叉干擾。

2） 走線方式

走線必須按照45°角拐彎或圓弧拐彎，這樣可以減小高頻信號的發射和相互之間的耦合，及減小信號反射。

3） 走線長度

走線長度越短越好，兩根線并行距離越短越好。

4） 過孔數量

過孔數量越多越好。

5） 層間布線方向

層間布線方向應該取垂直方向，就是頂層為水平方向，底層為垂直方向，這樣可以減小信號間的干擾。

6） 敷銅

增加接地的敷銅可以減小信號間的干擾。

7） 包地

對重要的信號線進行包地處理，可以顯著提高該信號的抗干擾能力，當然還可以對干擾源進行包地處理，使其不能干擾其他信號。

8） 信號線

信號走線不能環路，需要按照菊花鏈方式布線。

三、 接地處理

1） 射頻鏈路接地

射頻部分采用多點接地方式進行接地處理。射頻鏈路鋪銅間隙一般20mil到40mil用的比較多。兩邊都需要打接地孔，且間距盡量保持一致。射頻通路上對地電容電阻的接地焊盤，盡量就近打接地孔。器件上的接地焊盤都需要打接地過孔。

SICK S30B-2011BA 

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