| 日本OKAMOTO_GNX200BP全自動晶圓減薄 |
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價格： 元(人民幣) | 產地：本地 |
| 最少起訂量：1臺 | 發貨地：本地至全國 | |
| 上架時間：2022-06-22 16:03:11 | 瀏覽量：171 | |
深圳市衡鵬瑞和科技有限公司
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| 經營模式：貿易公司 | 公司類型：其他有限責任公司 | |
| 所屬行業：專用儀器儀表 | 主要客戶：馬康，田村，GOOT | |
 在線咨詢  |
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| 聯系人:劉慶 (先生) | 手機:13923818033 |
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傳真: |
| 郵箱:sales@hapoin.com | 地址:深圳市南山區南頭街道藝園路133號田廈1C產業園3018 |
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日本OKAMOTO_GNX200BP全自動晶圓減薄 日本OKAMOTO_GNX200BP全自動晶圓減薄概要 GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns. 了解更多：http://www.hapoin.com/Wafer_Grinding/ 日本OKAMOTO_GNX200BP全自動晶圓減薄相關產品： 衡鵬供應 日本OKAMOTO GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding |
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