| 晶圓研磨GNX200BP晶圓背拋 |
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價格： 元(人民幣) | 產地：本地 |
| 最少起訂量：1臺 | 發貨地：本地至全國 | |
| 上架時間：2019-11-07 09:45:15 | 瀏覽量：181 | |
深圳市衡鵬瑞和科技有限公司
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| 經營模式：貿易公司 | 公司類型：其他有限責任公司 | |
| 所屬行業：專用儀器儀表 | 主要客戶：馬康，田村，GOOT | |
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| 聯系人:劉慶 (先生) | 手機:13923818033 |
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| 郵箱:sales@hapoin.com | 地址:深圳市南山區南頭街道藝園路133號田廈1C產業園3018 |
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晶圓研磨GNX200BP晶圓背拋 ——又稱晶圓減薄/晶圓拋光（Wafer Grinding） GNX200BP晶圓研磨/晶圓背拋概要 GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns. GNX200BP晶圓研磨/晶圓背拋規格 Maximum wafer-machining diameter of wafer 64” or 8” Grinding Spindle: Bearing type Air bearing, maximum 3600rpm Motor 2.2kw,4P,high frequency motor Rapid feed speed 200mm/min Grind feed speed 1 to 999 μm/min Grinding wheel size ?250 mm Index Table: Number of work spindles 3 Work spindle Bearing type Mechanical Bearing, or Air Bearing (optional) Speed of Work Spindles 1 to 600 rpm Automatic Sizing Device: Wafer thickness measuring system 2 point contact in-process gauge Wafer minimum setting size 1 μm Wafer size display range 0to 1.2 mm; extended range software available Table Cleaning Device (Grinder side) Water + Ceramic block Wafer Cleaning Unit (Grinder side) Water + brush, and spin/rinse dry station Number of Cassettes 2 stations for each unit (Grinder & Polish unit) Polish head 3 Kw AC servo motor for 10 – 460 rpm Oscillation speed 100–8,000 mm/min. Head Load 50 –999 g//cm2 Pad size 200mm O.D. Polish table speed 3 Kw AC servo motor for 50 – 200rpm Vacuum Chuck material Alumina ceramics (dedicate size of wafer) Chuck cleaning Brush + Water Wafer cleaning N.C.W + DI water for Polish surface & Air blow spin dry GNX200BP晶圓研磨/晶圓背拋相關產品： 衡鵬供應 GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding |
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