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Key Features 產品特性：

Thermelt 867 is a pure copolymer polyamide hot melt resin, non reactive and solvent free, specially designed for Low Pressure Molding applications.
Thermelt 867 is mainly used for molding of electronic/electric components, connectors and cables.

• Standard molding resin mainly for automotive applications
• Versatile product with broad process and performance
• Flammability UL94 : V0
  (UL file E116659)

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