| 產品參數 |
| 品牌 | SINTAIKE |
| 功率 | 5.5KW |
| 重量 | 870 |
| 規格 | 全自動設備 |
| 尺寸 | 1750 mm (W) × 1350 mm (D) × 1800 mm (H) |
| 氣源 | 5.0 Kgf/cm2 CDA |
| 150 L/min |
| 適用范圍 | 4” |
| 5” |
| 6” & 8” |
| 是否進口 | 否 |
| 工作電壓 | 220V |
| 加工定制 | 是 |
| 送料形式 | cassette |
| 自動手動 | 全自動 |
| 貼片速度 | 60/h |
| 可售賣地 | 北京;天津;河北;山西;內蒙古;遼寧;吉林;黑龍江;上海;江蘇;浙江;安徽;福建;江西;山東;河南;湖北;湖南;廣東;廣西;海南;重慶;四川;貴州;云南;西藏;陜西;甘肅;青海;寧夏;新疆;臺灣;香港 |
| 用途 | 晶圓切割前貼膜 |
| 類型 | 立式 |
| 型號 | STK-7200V | |
Standard Configurations
? Special vacuum mounting technology without roller (Roller mounting Optional)
? Fully Automatic Wafer / Frame Loading & Unloading;
? Horizontal multi axis transfer robot for wafer transfer
? Vacuum fork for wafer handing
? Wafer alignment
? Wafer cassette loading
? Automatic Wafer Mapping in cassette
? ESD Mounting Roller and ESD Teflon Plating Contact Wafer Chuck;
? Industrial PC Based Control with 17” Touch Panel LCD;
? Compatible with normal wafer and thinner wafer;
? Compatible with 6” & 8” Frame;
? Non-UV & UV tape capability;
Options
? Wafer BG tape Detaping funtion
? Wafer OCR & Labling funtion
? Handling Wafer Box function
? Various Contact chuck to handle various wafer
? Non-contact wafer handling
? Bernoulli arm for ultra thinner wafer handling
Performances
Wafer Yield >= 99.9 (not include damage wafers)
Mounting Quality No Air Bubble (not include particle bubble)
UPH >= 60 PCs Wafer
MTBF > 168 Hours
MTTR < 1 Hour
Down Time < 3
Conversion Time <= 20 Minutes
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